Agilent Technologies E5500 Series Podręcznik Użytkownika Strona 91
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Preparing for Imaging 4
Agilent 5500 SPM User’s Guide 91
to excessive humidity, temperature changes or contact. Agilent
recommends that scanners be stored in a desiccator.
The scanner contains very brittle and fragile piezoelectric ceramics.
Applying excessive lateral force while exchanging nose assemblies, or
dropping the scanner even a short distance onto a hard surface, will
damage the scanner. If the nose assembly housing becomes loose or can
be wiggled when in place, contact Agilent support for assistance.
Cracked or broken piezoelectrodes will result in abnormal imaging.
Damage to the scanner such as those described above are NOT covered
by the standard warranty.
- Agilent Technologies 1
- 5500 Scanning Probe 1
- Microscope 1
- Specifications 4
- Laser Safety Information 4
- Power Supply 5
- Piezo Scanner Precautions 6
- General Care Requirements 6
- Disclaimers 6
- Declaration of Conformity 8
- Contact Information 9
- Table of Co ntents 10
- Read This First 10
- 2 Agilent 5500 SPM Components 10
- 4 Preparing for Imaging 11
- 5 Contact Mode Imaging 12
- 6AC Modes 12
- 7 Additional Imaging Modes 12
- 9 Closed-Loop Scanners 13
- 10 MAC Mode 14
- 11 MAC III Mode 14
- 12 Liquid Cell 14
- 13 Temperature Control 14
- 14 Environmental Control 15
- 15 Electrochemistry 15
- A Wiring Diagrams 15
- Index 15
- SPM Basics 18
- SPM Techniques 20
- Atomic Force Microscopy (AFM) 21
- Contact Mode AFM 23
- Intermittent Contact AFM 24
- Acoustic AC (AAC) AFM 25
- Current Sensing Mode (CSAFM) 27
- Agilent 5500 SPM Components 32
- Figure 10 33
- Agilent 5500 SPM Components 2 35
- Mode/Contact Mode imaging 37
- Detector 40
- Sample Plates 41
- Video System 43
- Head Electronics Box (HEB) 44
- AFM Controller 45
- Vibration Isolation Chamber 46
- Software 47
- System Options 48
- Thermal K 50
- Environmental Chamber 50
- PicoTREC 51
- PicoLITH 52
- Facility Requirements 55
- Utilities 56
- Connecting the Components 58
- Preparing for Imaging 59
- One-Piece Nose Assembly 60
- Preparing for Imaging 4 61
- Two-Piece Nose Assembly 67
- Aligning the Laser 72
- Figure 52 Laser alignment 77
- Mounting the Sample 83
- Using the Video System 86
- Contact Mode Imaging 92
- Constant Force Mode 93
- Constant Height Mode 100
- Fine-Tuning the Image 100
- Scan Settings 101
- Contact Mode Imaging 5 102
- AC Modes 103
- Acoustic AC Mode (AAC) 104
- AC Modes 6 106
- and/or Y Offset values to 108
- Magnetic AC (MAC) Mode 110
- Standard MAC Mode 111
- Q Control 112
- Additional Imaging Modes 114
- 1 G 100 M 115
- Current Sensing AFM (CSAFM) 119
- Additional Imaging Modes 7 123
- Kelvin Force Microscopy (KFM) 134
- Agilent Technologies 137
- Nose Assembly 138
- Scanner Characteristics 139
- Non-Linearity 140
- Sensitivity 140
- Hysteresis 140
- Figure 92 141
- Other Characteristics 141
- Figure 93) 142
- X Calibration 144
- X Non-Linearity 145
- X Hysteresis 146
- Y Calibration 147
- Y Non-Linearity 148
- Y Hysteresis 149
- Y Sensitivity 150
- Z Calibration 151
- Servo Gain Multiplier 152
- Archive the Calibration Files 152
- Closed-Loop Scanners 153
- Calibration 154
- set to 0.000 156
- Z Sensor Calibration 158
- Closed-Loop Scanners 9 160
- MAC Mode 162
- Connections 163
- Hardware and Sample Setup 164
- MAC Mode 10 165
- MAC III Mode 166
- Initial Setup 167
- MAC III Mode 11 169
- MAC III Software Controls 171
- Contact Mode 172
- Lock-In Tabs 183
- Outputs Tab 185
- Other Tab 188
- Liquid Cell 190
- Liquid Cell 12 191
- Liquid Cell with MAC Mode 193
- Flow-Through Liquid Cell 193
- Temperature Control 194
- Temperature Control 13 195
- Do not use double-sided tape 200
- Water Cooling 206
- Environmental Control 209
- Environmental Control 14 211
- Glove Box 212
- Electrochemistry 213
- Modes or STM Mode 214
- Electrochemistry 15 215
- Equipment 216
- Reference Electrode 217
- Counter Electrode 217
- Cleaning 218
- Electrode Cleaning 219
- Sample Plate Cleaning 219
- Substrate Cleaning 219
- Electrochemistry Definitions 220
- Software Controls 221
- Galvanostat 222
- Wiring Diagrams 223
- Appendix A 223
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